Abstract
Intermixing the wells and barriers of quantum well structures generally results in an increase in the band gap and is accompanied by changes in the refractive index. A range of techniques, based on impurity diffusion, dielectric capping and laser annealing has been developed to enhance the quantum well intermixing (QWI) rate in selected areas of a wafer; such processes offer the prospect of a powerful and relatively simple fabrication route for integrating optoelectronic devices and for forming photonic integrated circuits (PICS). Recent progress in QWI techniques is reviewed, concentrating on processes which are compatible with PIC applications, in particular the achievement of low optical propagation losses.
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