Quality factor and digital inverter performance in gate underlap and overlap DMG FinFETs

Abstract

This paper presents a comparative 3D simulation study of Quality factor among Gate Underlap and Overlap techniques in both Si and Ge Dual Material Gate (DMG) FinFETs using the Sentaurus TCAD tool. The results of both the techniques are carefully examined and compared with Conventional DMG FinFET to analyze the performances of these devices. The effect of gate overlap/underlap techniques on threshold voltage (Vth), ION/IOFF ratio, drain induced barrier lowering (DIBL), transconductance (gm), subthreshold swing (SS), and Quality factor (Q) are investigated. It is found that Ge DMG FinFETs have higher gm and quality factor values as compared to Si DMG FinFETs. The prospects of these techniques in low-power digital applications have been performed by implementing complementary Si DMG FinFET based inverter circuit. We have extracted the average delay and noise margin, where the overlap structure performs better such as high current gain and no overshoot/undershoot peaks in the transient characteristics.