Quality Control of Thick Film Hybrid Integrated Circuit Process Design and Manufacturing

Abstract

With the continuous upgrading of the technological content of electronic products, higher requirements have been put forward for the manufacturing process of thick film hybrid integrated circuits, resulting in the manufacturing process of thick film hybrid integrated circuits. Thick-film hybrid integrated circuits are an important realization method of microelectronic components. They are widely used in many fields such as civil, military, and aerospace satellites. An important reason is that the thick film process has a super high cost performance compared with other process realization methods. Thick film conductive paste is the most core material in the thick film process. Its interconnection performance such as sintering and welding directly affects the performance of the finished thick film components. Therefore, the thick film conductive paste interconnection under specific process conditions is evaluated. Related performance is crucial. In the mass production process of thick film hybrid integrated circuits, it is particularly important to control the quality and increase the product growth rate. This paper introduces the description of the quality management of the rear-film hybrid integrated circuit production line in the aspects of thick-film hybrid integrated circuit quality system construction, raw material procurement, supplier management, project quality management, on-site management, etc. The manufacturing process of the back-film hybrid integrated circuit briefly introduced has stable performance, high reliability and wide application fields in terms of manufacturing characteristics. Studies have shown that the manufacturing process is suitable for mass automated production, and has the advantages of simple process, low investment, and quick results.