Abstract
Three--Dimensional Stacked Dies. Cofired Ceramic Substrates. Organic Laminated Substrates and Chip--on--Board. High--Density Interconnects and Deposited Dielectrics. Wire and Wirebonds. Tape Automated Bonds. Flip--Chip Bonds. Device and Substrate Attachment. Cases. Leads. Lead Seals. Lid Seals. Material and Product Evaluation Methods. Rework Methods. Bibliography. Index.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
