Abstract
Miniaturization also takes place in Multilayer ceramics technology, such as Low Temperature Co-fired Ceramic (LTCC). Even if the functionalities seem to rise endless. In the traditional LTCC manufacturing, there is a development to thin materials recognizable, limited by the minimum thickness of the Mylar foil. The only variable parameter is the thickness of the ceramic cast on the foil. Also, in other ceramic applications, there is a development to thicker sheet thickness for various applications from different industries. Furthermore embossing is taking place in the ceramic industry as a production method. In order to perform high class punched and embossed quality for the hole/structures such as via, alignment or cavity raises the requirements for the complete punching tool and as well for the punching components - for example punch, die guide or stripper bushing. Where the laser technologies may see his limits, punching technology can be the right solution. This paper is to report the advantages and the limits of punching technologies in the ceramic as well as to explore the feasibility and current punching technological limits of today's manufacturing technologies
Published Version
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