Abstract
Thin Cu/Ni multilayers were deposited on a rotating disk electrode by square‐wave galvanostatic pulses in one‐third and full strength Watts nickel baths with 50 to 1000 ppm CuCu2+. A theoretical model was developed to predict the copper content in the Ni layer. Factors affecting the deposition which include the mass‐transfer rate, copper ion concentration, temperature, and applied current density were studied. The copper content in the Ni layer was analyzed experimentally by x‐ray diffraction and potentiodynamic stripping. Theoretical predictions are in good agreement with experimental results.
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