Pulsed-DC Discharge for Plasma CVD of Carbon Thin Films

Abstract

A pulsed-dc discharge method for plasma chemical vapor deposition (CVD) was developed using a constructed versatile pulsed-dc generator and a vacuum discharge chamber. Argon (Ar) gas discharge experiments were performed under a variety of discharge conditions, and plasma conditions were evaluated using optical emission spectroscopy. The developed system can perform glow discharge by employing nearly rectangular, unipolar, and high-voltage negative pulses with a wide variation of voltage amplitudes and a set discharge current, pulse repetition rate, and duty cycle. Plasma conditions could also be tuned by varying the pulse parameters. A preliminary test of the deposition of diamond-like carbon (DLC) films on silicon (Si) substrates and ultrathin pyrolytic carbon (PyC) films on nanothickness metal-catalyzed glass substrates was performed with acetylene (C 2 H 2 ) by selecting some typical deposition conditions based on the gas discharge experiments. The deposited films were characterized via Raman spectroscopy. The characteristic properties of DLC and PyC films were achieved. The DLC films demonstrated conventional hard insulating properties while the ultrathin PyC films exhibited conductive and semitransparent properties. These results revealed that the developed pulsed-dc discharge system for plasma CVD is applicable for the synthesis of insulating hard as well as soft conducting carbon thin films.