Abstract
We present a laser machining method based on the use of pulsed Bessel beams to create, by single pass transverse writing, three-dimensional trench-like microstructures on a synthetic monocrystalline diamond substrate. By tuning the laser pulse energy and the writing speed, it is possible to control the features of the surface trenches obtained and to optimize the resulting high aspect-ratio and low roughness microstructures. This work confirms the potentialities of quasi-stationary beams in ultra-fast laser inscription technology. In particular the presented results show the possibility to fabricate deep and precise microfluidic channels on biocompatible diamond substrates, offering a great potential for biomedical sensing applications.
Highlights
Diamond substrates and films have been adapted for many uses because of the material's exceptional properties such as the highest thermal conductivity, high mechanical hardness, wide bandgap, very good optical properties as well as chemical resistance
We present a laser machining method based on the use of pulsed Bessel beams to create, by single pass transverse writing, three-dimensional trench-like microstructures on a synthetic monocrystalline diamond substrate
Note that the time employed to machine tracks as those presented here is scalable and can be drastically reduced provided we use a kHz laser, for which thermal effects during the laser fabrication are still negligible, and each laser pulse acts on the material independently
Summary
Diamond substrates and films have been adapted for many uses because of the material's exceptional properties such as the highest thermal conductivity, high mechanical hardness, wide bandgap, very good optical properties as well as chemical resistance. Abstract: We present a laser machining method based on the use of pulsed Bessel beams to create, by single pass transverse writing, three-dimensional trench-like microstructures on a synthetic monocrystalline diamond substrate.
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
