Abstract
Partial transient liquid phase bonding was applied to a silicon nitride/iron aluminide alloy (FA-129) joint. This joint was composed of two independent joining systems. The joint configuration was Si 3 N 4 /75Cu–25Ti/Cu/Ni/Al/FA-129. The results demonstrate that homogenization has no effect on the kinetic of the reaction layer formation between the ceramic and the nickel core due to a previous dissolution reaction. The reaction layer composition evolves from a TiN–Ti 5 Si 3 layer system after reaction during the first soaking time, to a single TiN layer after the complete cycle. The dissolution of the Ti 5 Si 3 layer in the Ni core becomes the driving factor influencing the properties of the joint. The composition of the copper–nickel alloy interlayer changes with homogenization treatment, passing from a maximum of 70–20 wt% Cu, depending on the conditions. NiAl and Ni 3 Al intermetallics were observed at the interface between the nickel and the FA-129 and their thicknesses varies with the homogenization conditions. The strength values obtained were within the range of 80 MPa, with the ceramic reaction layer being the region where all failures occurred.
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