Abstract
Copper has many benefits with its extensive electrical properties, but is prone to corrosion in oxide, sulfate, and sulfide environments. Based on our previous studies of as-deposited TiO2-SiO2 films which acted as protective coatings against sulfide and sulfate on silver, we extended our research to the same films coated on copper and checked the corrosion rates using Tafel plots. The dip-coated sol–gel TiO2-SiO2 films reduced the corrosion rate four times compared to the bare copper surface due to Ti-O-Si bonds formed in the mixed metal oxide films which enhances the adherence to the substrate, observed in the Raman spectroscopy studies.
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