Abstract
AbstractTime of Flight Secondary Ion Mass Spectrometry (ToF‐SIMS) and XPS were utilized to assess the surface characteristics of the bonding wire generally used in electronic packaging applications. This paper outlines the proposed standard methodologies for the analysis of the high‐curvature surfaces of the fine bonding wires (less than 1.2 mil (30 micron) in diameter) using specially designed stages and systematic data acquisition and analysis. Examples are given to showcase the effectiveness of the methodology, which is able to differentiate various industrial process residues and contaminants on the bonding wire. A preliminary draft of the proposed standard surface characterization methods is presented. Copyright © 2010 John Wiley & Sons, Ltd.
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