Abstract
This paper proposes an experimental package type with a new structure and material that can evaluate the HBM reliability accurately by overcoming the limitations of the previous proxy package.This is based on the revision to the package type that reflects the actual user environment which was not applied in the previous type. First,side and top EMC were eliminated to enhance the consistency with SIP and the proxy package. Secondly, the Si interposer which is used to connect HBM to PCB was altered from wire bonding to TSV structure.Lastly, NCF is changed to Underfill between HBM and the Si Interposer to create an environment identical to that of SIP. Through using this new package type, the failure rate by temperature cycling during 1000 cycles in HBM2E showed 0% from the previous 13%, and that during 2000 cycles in HBM3 showed 0%, and as a result, the HBM memories are well in volume production.
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