Abstract
Commercial thick-film resistor pastes were printed on and embedded in cordierite+borosilicate glass low-temperature co-firable ceramic (LTCC) substrates. The electrical properties of the resistors were found to depend on the final microstructure. Anorthite crystals were produced by the interaction between the substrates and glass composition of the resistor films at boundaries. The anorthite crystals grown into the substrate and the resistor layer increased the overall resistance. Sedimentation of the conductive particles and glass migrating to the substrates decreased the resistor thickness during sintering. Conductive particles in the resistor films flocculated after firing at 850° and 900°C. Formation of anorthite crystals, conductive particle sedimentation, glass migration, and inter-diffusion were determined to be three major factors determining film resistivity.
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