Abstract
Films with an aluminum content of about 50% in Ni-Cr were produced as a continuation of investigations on multicomponent thin alloy films based on Ni-Cr, because an additional zero transition for the temperature coefficient of resistance (TCR) of these thin films was indicated in the earlier investigations. The alloy films were evaporated in high vacuum onto ceramic substrates and measurements of the TCR and the stability were carried out. It was found that the TCR is less than ±50 ppm K -1 for aluminum concentrations between 45 and 65 at.%. Such films are suitable for the production of metal film resistors.
Published Version
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