Abstract
Multicomponent alloy thin films based on Ni-Cr with a high silicon content were deposited in a high vacuum onto ceramic flat substrates and investigated. After annealing in air the Ni-Cr-Si films show a high stability. It has been found that the temperature coefficient of resistance has values around zero in a range of the film composition from 5 to 20 at.% Ni, from 20 to 40 at.% Cr and from 50 to 65 at.% Si. This range of the film composition is suitable for the production of metal film resistors by means of sputtering.
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