Abstract
This paper starts with the description of a new direct chemical plating method for silver, called the JET METAL (JMT) process and of the JET SELECTIVE process, which allows to obtain a selective metallization on any substrate which can be metallized with the JET METAL process. This technology is based on spraying separately an aqueous solution containing silver metallic ions together with a CMR free, aqueous based reducing agent. This process allows to plate chemical silver at twelve microm/hour at room temperature and at ambient pressure and is already used in industrial processes for metallizing plastics, composites and non-conductive materials in general and this in different formats (3D pieces, 2D foils, In the second part, results obtained with metallized antenna patch realized with the process described above are shown and discussed.
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