Abstract
This paper gives the description of a new direct chemical plating method for silver, called the Jet Metal (JMT) process and of the Jet Selective process, which allows obtaining a selective metallization on any substrate which can be metallized with the Jet Metal process (Stremsdoerfer, n.d. [1]). This technology is based on spraying separately an aqueous solution containing silver metallic ions together with a CMR free, aqueous based reducing agent. This process allows plating chemical silver at 12μm/h at room temperature and at ambient pressure and is already used in industrial processes for metallizing plastics, composites and non-conductive materials in general and this in different formats (3D pieces, 2D foils, …). In the second part, some functional applications are discussed.
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