Production of low-energy SiCH3+ and SiC2H7+ ion beams for 3C-SiC film formation by selecting fragment ions from dimethylsilane

Abstract

Fragment ions produced from dimethylsilane (DMS) in a Bernas-type ion source were investigated. Dominant fragment ions were identified to be CH3+, Si+, SiH3+, SiCH3+, and SiC2H7+. We mass-selected SiCH3+ and SiC2H7+ ions and then produced low-energy SiCH3+ and SiC2H7+ ion beams. Subsequently, these ion beams were used to irradiate Si(111) substrates at 800 °C. The energies of SiCH3+ and SiC2H7+ ions were set at 100 eV. We found that the irradiation of these ions led to the deposition of silicon carbide (3C-SiC) films on the Si substrates. For comparison, SiC film formations on Si(111) substrates were also attempted by the chemical vapor deposition (CVD) method using DMS. The X-ray photoelectron spectroscopy measurements showed that atomic ratios of C to Si (C/Si ratio) of the films obtained by the irradiation of SiCH3+ and SiC2H7+ ion beams were 1.2 and 1.2, respectively. Conversely, the C/Si ratio of the film obtained by CVD was 1.9. Raman spectroscopy showed that the film obtained by CVD included diamond-like carbon. These results suggest that the low-energy mass-selected ion beam deposition technique using DMS-derived fragment ions is practicable for the 3C-SiC deposition on Si substrates.