Abstract
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and integrated luminosities realised following the shutdown. Because of the extreme radiation and collision rate environment, several new radiation-tolerant sensor and electronic technologies were utilised for this layer. This paper reports on the IBL construction and integration prior to its operation in the ATLAS detector.
Highlights
The ATLAS [1] general purpose detector is used for the study of proton-proton and heavy-ion collisions at the CERN Large Hadron Collider (LHC) [2]
With increasing radial distance from the interaction region, it consists of silicon pixel and micro-strip detectors, followed by a transition radiation tracker (TRT) detector, all surrounded by a superconducting solenoid providing a 2 T magnetic field
It was designed to operate for the Phase-I period of the LHC, that is with a peak luminosity of 1 × 1034 cm−2s−1 and an integrated luminosity of approximately 340 fb−1 corresponding to a Total Ionising Dose (TID) of up to 50 MRad2 and a fluence of up to 1 × 1015 neq /cm2 non-ionising energy loss (NIEL)
Summary
The ATLAS [1] general purpose detector is used for the study of proton-proton (pp) and heavy-ion collisions at the CERN Large Hadron Collider (LHC) [2] It successfully collected data at pp collision energies of 7 and 8 TeV in the period of 2010-2012, known as Run 1. The main motivations of the IBL were to maintain the full ID tracking performance and robustness during Phase-I operation, despite read-out bandwidth limitations of the Pixel layers (in particular the BLayer) at the expected Phase-I peak luminosity, and accumulated radiation damage to the silicon sensors and front-end electronics. QA of the individual pixel module components (the sensors, front-end electronics, and module hybrids) This is followed by a discussion of the module assembly and tests to ensure the required electrical and mechanical quality of the modules.
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