Abstract
Process-simulation systems for ultraviolet (UV) nanoimprint lithography are newly proposed to investigate process physics and resist profiles. The system consists of four modules, which simulate fluid dynamics in the resist-filling process into a pattern, the optical-intensity distribution in the UV exposure process, the mechanical properties in UV curing, and the resist profiles by UV shrinkage. Each module is independent, but shares physical parameters and resist profiles. Simulations on resist profiles by the UV curing process are demonstrated, taking the optical-intensity distribution into account. Also, a database model is newly introduced to simulate the resist profile due to shrinkage by UV curing.
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