Abstract
Silicon is an auspicious material for the fabrication of sensors. At the same time silicon is not amenable for the integration of different types of sensors. In device fabrication semiconductor technology etching is very much necessary to selectively vanish the materials from a minute film with or without proper structures on the exterior of the substrate material. The etching procedure removes the identified region on the surface so as to deposit the other materials. This helps to obtain functional structures on the substrate. At the same time the wafer is protected by using a photoresist material such as silicon nitride. This paper describes the process of sensor fabrication and the materials used for the fabrication of semiconductor. The primary objective is to obtain better performance levels, manufacturability, reliable and cost effective product in Integrated Circuit (IC) fabrication industry.
Published Version
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