Abstract
A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.
Highlights
Polytetrafluoroethylene (PTFE) has an unusual combination of high thermal stability, chemical inertness, and electrical stability
Modern applications ranging from highfrequency telecommunications systems to high rate of bytes/s in current computers have set new requirements on Printed Circuit Board (PCB)
The test of copper peel strength was done with XLW (PC) Auto Tensile Tester; we can see this system in Figure 6 and the best result was 3.93 pounds/inch, which is as good as some commercial PCB’s or better [6, 7]
Summary
Polytetrafluoroethylene (PTFE) has an unusual combination of high thermal stability, chemical inertness, and electrical stability. The properties of PTFE have led to many successful chemical and electrical applications, such as electrical cable, lining for reactor, and antisticking coatings for kitchen utensil and tapes. The tremendous progress that has been made in the past four decades in miniaturizing and integration transistors onto silicon has contributed to the continuing increase in component, performance, and load density [2]. All progresses have required that transmission lines find a corresponding way for increasing density of the substrate and reducing losses. Modern applications ranging from highfrequency telecommunications systems to high rate of bytes/s in current computers have set new requirements on Printed Circuit Board (PCB)
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