Abstract
Advanced structural ceramics, such as silicon nitride or alumina, are attractive for many advanced applications due to their high strength at elevated temperatures, wear resistance and chemical stability. During the sintering process ceramics undergo a volumetric shrinkage and thus are far from meeting high demands on their form and size accuracy. To meet these demand in most cases grinding with diamond tools is necessary as a finishing process. The cost associated with this manufacturing step may reach up to 60 % of the total cost thereby diminishing the competiveness of ceramic parts. The paper presents an approach in grinding of these materials, based on the model of the equivalent chip thickness in grinding. The correlation between the chip thickness and the subsurface damage is used for the process layout. Thereby it is possible to reduce machining time effectively and to avoid effects of the grinding process on materials strength.
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