Abstract
The operational properties and the performance of components consisting of advanced ceramic materials, for example silicon carbide and silicon nitride, are mainly influenced by processing technology and process conditions. In grinding operations grain engagement and process kinematics determine the resulting surface topography as well as the degree of potential rim defects. The modelling of grain engagement and the computation of uncut chip thickness describe suitable ranges for process parameters resulting in minimized subsurface damages of the ceramic part. By means of single grain diamond scratch tests the limiting uncut chip thickness at the transition between plastic deformation of workpiece material and the occurrence of brittle microchippings during chip removal is evaluated. Based on theoretical models and experimental investigations a contribution to practical applications in grinding of advanced ceramics is explained.
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