Abstract
Abstract This paper outlines a procedure which may be used to formulate a mathematical expression useful for determining thermal management requirements in a semiconductor diode laser structure. A semi-analytical expression is derived for the steady state operating temperature of the laser emitter for a laser array structure. The methodology combines a finite element analysis (FEA) of thermal profiles in a laser structure, a design of experiments (DOE) investigation of various parameters involved in the heat generation and dissipation process, and a theoretical heat transfer analysis of the structure under operation. The FEA output produces a 2-dimensional transient and steady state temperature profile within the laser structure. The FEA method is then used in performing a DOE investigation to determine the thermal effect of specified operating parameters, including laser emitter spacing, laser performance requirements (output power), and heatsink material. Physical relationships derived from heat transfer analysis of the laser structure are used to determine the subset of heatsink material characteristics necessary to produce a valid expression for steady state operating temperature in the laser emitter region as a function of our design variables. Results of the analysis are applied to diode laser degradation mechanisms and the thermal enhancement factors for each mechanism are calculated. This procedure may be used to assess different thermal management strategies and their implications on reliability.
Published Version
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