Abstract
Electrostatic chucks (ESCs) are major components of the equipment used to improve the production yield of wafers and temperature uniformity across wafer surfaces by controlling the wafer temperature precisely. However, ESCs are directly exposed to harsh environments, such as plasma, chemical gases, and high temperature fluctuations. Therefore, ESCs may malfunction if used for a certain period. Therefore, repair and performance verification of failed ESCs are required. In this study, we developed a multizone probe card system suitable for electrical testing of the heating electrodes embedded in ESC control modules to correlate the failure mode factors of ESCs. This system has the advantages of examining the resistance of the internal heating electrode of a 144-zone ESC in a short time and detecting an abnormality in this component based on the measured data. The heating electrode resistance measurement error rate of the developed system was 1%, and the maintenance time was reduced by approximately 66% compared with that of existing ESC maintenance methods.
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