Abstract
Compositionally graded InAlAs buffers grown by metal–organic chemical vapor deposition are impaired by phase separation occurring at In content higher than 35%. Phase separation results in rough epilayers with poor crystalline material quality. By introducing low temperature grown InGaAs interlayers in the compositionally graded InAlAs buffer, the surface roughness decreases, allowing a grading of up to In0.60Al0.40As without any phase separation occurring. This composite buffer is applied to fabricate a 200mm diameter InP-on-Si virtual substrate with a threading dislocation density around 1×108cm−2.
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