Abstract

Pressureless low-temperature sintering technology offers new opportunities for application in 3D stacked-layer packaging and heterogeneous integration. In this paper, we introduce a new low-temperature pressureless sintering technology based on plasma activation of nano-silver paste, which can effectively remove organic matter from the solder paste. Only need to activate the solder paste for 10 s, and sinter at 200°C for 10 min, so that low-temperature pressureless sintering of solder paste can be achieved. it is believed that this facile and economical method has high potential for die attach.

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