Abstract
This paper presents the results of finite element simulations of the lamination process for the fabrication of organic light-emitting diodes (OLEDs). The simulations utilize mechanical properties of the individual layers of the OLED structures that are obtained using nanoindentation techniques. The simulations show that applied pressure can cause contact evolution and sink-in around dust particles that are interposed between the organic materials layers, or the organic/inorganic layers. The implications of the results are discussed for the fabrication of robust OLEDs.
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