Pressure activated interconnection of micro transfer printed components

Abstract

Micro transfer printing and other forms of micro assembly deterministically produce heterogeneously integrated systems of miniaturized components on non-native substrates. Most micro assembled systems include electrical interconnections to the miniaturized components, typically accomplished by metal wires formed on the non-native substrate after the assembly operation. An alternative scheme establishing interconnections during the assembly operation is a cost-effective manufacturing method for producing heterogeneous microsystems, and facilitates the repair of integrated microsystems, such as displays, by ex post facto addition of components to correct defects after system-level tests. This letter describes pressure-concentrating conductor structures formed on silicon (1 0 0) wafers to establish connections to preexisting conductive traces on glass and plastic substrates during micro transfer printing with an elastomer stamp. The pressure concentrators penetrate a polymer layer to form the connection, and reflow of the polymer layer bonds the components securely to the target substrate. The experimental yield of series-connected test systems with >1000 electrical connections demonstrates the suitability of the process for manufacturing, and robustness of the test systems against exposure to thermal shock, damp heat, and mechanical flexure shows reliability of the resulting bonds.