Abstract
The trend toward narrower line width in semiconductor manufacturing has made contamination control more and more important. The presence of moisture in wafer containers, such as front opening unified pods (FOUP), can lead to the native oxide residues growth, metal corrosion, and thin film cracking on wafer surfaces. Accordingly, decreasing contamination methods and improving factory efficiency are continuously researched. Single or multi-layer particulate shields on top of wafers in FOUPs may be used to prevent pollutant accumulation. In addition, point-of-use (POU) filtration may also been used to control particle contamination in FOUPs during wafer transformation and storage. The demand for stricter filtration led to the usage of 0.10 and 0.20 µm membranes to control the contamination. However, with the introduction of finer membranes end users may have concerns about deleterious remainders on wafers from undergoing filtration. There are a total of 25 pieces of wafers in the FOUP and the arrangement is from the bottom (wafer No. 1) to the top (wafer No. 25) with arising manner. Purging FOUPs to expel moisture vapors with Clean Dry Air (CDA) is one of the most popular methods.There was no previous research for investigating the purge performance on new-generation 450mm FOUPs. This research aims to study main factors influencing the performance of the purge system on 450mm FOUPs, including moisture concentration, CDA flow rate, and filter pressure.
Highlights
To involute semiconductor manufacturing is extending as ICs goes on the shrinking feature sizes scale
The atmosphere interior of the front opening unified pod (FOUP) includes of primary air that runs into from the process tools while wafer transfer steps, together with some air that gets through a breather filter while pressure equalization of the closed FOUP
The objective of this study is to study the key parameters, including moisture concentration, Clean Dry Air (CDA) flow rate, and filter pressure, which influence the performance of the pre-filtration and purge system under the challenging conditions
Summary
To involute semiconductor manufacturing is extending as ICs goes on the shrinking feature sizes scale. Once the air flow into the process tool is at the higher pressure than that of the circumjacent fab typically, the interior of a FOUP is not vigorously pressurized during the door closed. [1] The application of point-of-use filters have been joined into the dispense systems and assure the removal of undesired particles from the International Journal of Engineering & Technology photo resist users to prevent the deposition of unwanted particles into the wafer surface while the semiconductor chips fabricate. The objective of this study is to study the key parameters, including moisture concentration, CDA flow rate, and filter pressure, which influence the performance of the pre-filtration and purge system under the challenging conditions
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