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Abstract
A method for preparing TEM specimens from fragile metal organic resin and metal‐organic‐derived ceramic films is described. Unsupported films can be easily prepared by spin coating a metal organic solution onto a camphor substrate followed by separating the film by subliming the substrate. The method involves encapsulating the fragile film fragments in a low‐viscosity, thermosetting, epoxy‐hardener solution to obtain mechanical integrity. The encapsulated film can be easily hand polished to approximately 20‐μm thickness in less than 1 h. Electron‐transparent TEM specimens can then be prepared by ion‐beam thinning the encapsulated film, after mounting it on a slotted copper grid.
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