Abstract
The results of experimental research into ultrafine copper silicide production in plasma high-current pulsed arc discharge are shown. According to X-ray diffraction, the product consists primarily of η″-Cu3Si (81%) and contains copper and silicon. A study of the material by transmission electron microscopy reveals the formation of elongated pointed copper silicide crystals with cross-sectional dimensions of approximately 250 nm. The presented method of preparation of copper silicide allow one to obtain grams of the ultrafine product per one operating cycle of the system, the duration of which is about 0.5 ms. The materials prepared may be used in the power industry, for example, for the manufacture of electrode systems of power supplies.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
