Abstract
In this paper, tungsten-copper composite powder was prepared on the particle size of 6 ~ 10μm tungsten powder surface by electroless copper plating. The orthogonal experimental results show that the primary and secondary order of factors affecting the deposition rate followwing the sequence: copper sulfate solution concentration > pH value> solution temperature> formaldehyde concentration > complexing agent concentration. The process of the electroless copper plating on the tungsten powder surface was investigated, and the best electroless copper plating solution composition and operation conditions were obtained as follows: plating temperature 323 K, stirring speed 30 r/min, PH =13, loadage 8g/L, CuSO4 5H2O 0.032 mol/L, HCHO 0.274 mol/L, TEA 0.1208 mol/L, 2, 2 'league pyridine 12 mg/L.
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