Preparation of diamond/SiC composites by the liquid silicon infiltration method and their microstructure and properties

Abstract

Diamond/SiC composites have long been recognized as advanced materials for thermal management as they exhibit excellent thermal and mechanical properties. The objective was to investigate and understand the phase composition, diamond graphitization behavior, microstructure, and properties of diamond/SiC composites developed following the liquid silicon infiltration process. The results revealed that the incorporation of α-SiC particles increased the degree of uniformity of the microstructure of the diamond/SiC composites. The acoustic mismatch model was used to analyze the samples before and after diamond graphitization to evaluate the interfacial thermal resistance of the composites. The results indicated that the interfacial thermal resistance of the graphitized composites was 11.9 times higher than the interfacial thermal resistance of the un-graphitized composites. Finally, the correlation between the diamond content of the composites and their thermal and mechanical properties was investigated.