Abstract
This work adopted a novel method to prepare cyanide-free gold-tin alloys thin-film via using ultrasonic-assisted pulse electrodeposition. The effects of ultrasonic were studied and the optimal ultrasonic time was determined. It was demonstrated that ultrasonic wave can enhance the ion diffusion ability of the cyanide-free Au-Sn alloys electroplating solution and hinder the generation of bubbles on the surface of the cathode. As a result, a uniform and dense gold-tin alloys coating was obtained. Moreover, the ultrasonic facilitated the increase of deposition rate and the reduction of the content of Sn with the range of 30–60 at.% compared with stirring-pulse electrodeposition. The gold-tin alloys thin-film can be used in electronic packaging.
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