PREPARATION OF Cu-SiO2/PA12 COMPOSITE POWDERS BY ELECTROLESS PLATING FOR USE IN SLS PROCESSING

Abstract

In this work, SiO2-encapsulated copper particles/PA12 (Cu-SiO2/PA12) composite powders were prepared by electroless composite plating, and the laser sintering behavior was investigated. Results showed that Cu, Cu2O, CuO, and SiO2 (Cu-SiO2) composite particles were plated on the surface of KH550-modified PA12 powders. The Cu-SiO2 particles existed independently on PA12 surface, and the size was around 200 nm. The melting temperature and crystallization temperature of Cu-SiO2/PA12 composite powders were 183∘C and 150∘C. The results indicate that the selective laser sintering (SLS) process involved the contact of Cu-SiO2/PA12 powders, the formation of sintering neck, the growth of sintering neck, and the formation of fused solid. The Cu-SiO2 composite particles uniformly dispersed in the part due to surface tension, and the contact interface was good due to their similar polarity. The Cu-SiO2/PA12 SLS parts had excellent dimensional precision. The tensile strength of the 15[Formula: see text]W-sintered Cu-SiO2/PA12 specimen was 48[Formula: see text]MPa.