Abstract
Laser powder bed fusion (LPBF) technology is beneficial for the fabrication of thermal conductive materials, integrating with the predesigned structure, which shows a great potential for high heat dissipation applications. Here, a Cu–Cr–Zr alloy with relative density of 98.53% is successfully prepared by LPBF after process optimization. On this basis, microstructure, phase identification, precipitates, mechanical and thermal properties are investigated. The results demonstrate that the surface morphology of microstructure is affected by laser energy density, the α-Cu is the main phase of the LPBF sample and the virgin powder, the size of Cr spherical precipitates in some areas is about 1 μm, and the tensile fracture mode is a mixed ductile–brittle mode. Furthermore, the Vickers hardness of the LPBF Cu–Cr–Zr sample is 70.7 HV to 106.1 HV, which is higher than that of LPBF Cu and a wrought C11000 Cu, and the difference in Vickers hardness of different planes reflects the anisotropy. Ultimately, the two types of Cu–Cr–Zr alloy heat sinks are successfully fabricated, and their heat transfer coefficients are positively correlated with the volume flow. The heat dissipation performance of the cylindrical micro-needle heat sink is better, and its maximum heat transfer coefficient is 3887 W/(m2·K).
Highlights
IntroductionFor its excellent electrical conductivity, thermal conductivity and ductility, copper is an indispensable material in the fields of electronics, automobiles, aerospace, and machinery [1]
After the one-dimensional to the three-dimensional optimization, Table 5 shows that the optimal relative density of sample 2 is 98.53%, but the corresponding laser energy density is between 133 J/mm3 of sample 4 and 208 J/mm3 of sample 13, which shows that the laser energy density and the relative density do not show a simple positive correlation
For the integration requirements of heat dissipation materials and structures in the electronic field, the Cu–Cr–Zr alloy with a relative density of 98.53% is successfully prepared by Laser powder bed fusion (LPBF)
Summary
For its excellent electrical conductivity, thermal conductivity and ductility, copper is an indispensable material in the fields of electronics, automobiles, aerospace, and machinery [1]. The strength of pure copper is low, the research focus has shifted to copper alloys with excellent comprehensive properties. Cu–Cr–Zr alloy is widely applied in the electronic components and aerospace fields due to its high strength, as well as excellent electrical conductivity and thermal conductivity [2,3,4]. In order to meet the needs of industrial production, current copper alloy materials need to have high strength, high electrical conductivity and thermal conductivity, which poses a huge challenge to the existing copper alloy forming process [5]. LPBF technology has high forming accuracy, high utilization rate of materials, fine structure grains after forming, and excellent comprehensive performance [6]
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