Abstract
Cr7C3 coatings were formed on diamond particles for improving the wettability between diamond particles and copper. The coatings were formed with a reaction medium of chromium in mixed molten salt. Copper–diamond composites with Cr7C3 coatings on diamond particles have been fabricated by vacuum pressure infiltration method. The microstructure of interfacial bonding between diamond and copper was discussed. Thermal conductivity and thermal expansion behavior of the obtained copper–diamond composites with various fractions of diamond particles were investigated. The as-fabricated composite exhibit a thermal conductivity of 562 W m−1 K−1 associated with coefficient of thermal expansion of 7.8 × 10−6 K−1 with a Cr7C3-coated diamond volume fraction of 65%. These results indicate that the obtained composites are suitable for being heat sink applications.
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