Abstract
Abstract The solder layer constitutes a crucial component of IGBT power modules. It endures significant thermal stress during operation, and the magnitude of this stress correlates with the coefficient of thermal expansion. To prevent fatigue damage to the solder layer during operation, it is necessary to reduce the solder’s coefficient of thermal expansion, thereby alleviating the impact of thermal stress. In this paper, the method of adding carbon nanotube powder to solder is proposed to solve this problem. Firstly, the relationship between thermal stress and the coefficient of thermal expansion is analyzed, and then the mechanical ball milling method is employed to prepare composite solder with a 0.05% carbon nanotube content. Scanning electron microscopy observation of the prepared composite solder reveals homogeneous mixing and uniform distribution of carbon nanotubes on the solder particle surfaces. Furthermore, thermal expansion coefficient tests were conducted on the sintered carbon nanotube composite solder, revealing a 16.2% reduction in the coefficient due to the incorporation of carbon nanotubes.
Published Version
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