Preparation and Thermal Conductivity Behavior of Elastomeric Silicon Rubber-Aluminum Nitride Composite

Abstract

The thermal conductive silicon rubber have been prepared by using aluminum nitride as filler. The morphology and dispersion propriety of the filler were investigated by Scanning electron microscopy. The thermal conductivity of the composites was analysized by thermal measurement system. The results show that The larger particles give rise to a higher thermal conductivity of composites, at the same time the thermal conductivity of the composites increase with increase of aluminum nitride filler fraction. When the particle size is 60 nm, the thermal conductivity of composites at 40% volume fraction is about 3.5times that of pure silicon rubber matrix.