Abstract

A silver-coated copper powder with an added transition Sn layer is obtained by electroless plating, and the prepared composite powder is heat-treated under a protective atmosphere to form a transition layer by diffusion between metal atoms for improved powder properties. The effect of the transition layer on the morphology, adhesion and oxidation resistance of the copper-coated copper powder is studied. The results show that the Cu/Sn/Ag composite powder exhibits excellent plating adhesion and oxidation resistance performance when the content of the intermediate layer is 10% of Sn.

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