Preparation and properties of novel silicon-containing polyarylacetylene resin based wave-transparent composite

Abstract

In order to satisfy the requirement of high-temperature resistant wave-transparent composite in project field, a quartz fiber (QF) reinforced novel silicon-containing polyarylacetylene (PSA) resin based composite (QF/PSA) was researched and characterized. Firstly, viscosity prediction model of different temperature and time was established based on the viscosity-time curves of the resin, the model indicates that the resin can be injected between 70~100℃ for resin transfer molding (RTM) process. The curing heat, FT-IR spectra and rheological behavior of the resin were analysized, then the curing temperature and process were revealed. The results show that the resin can be curved at 250℃. Based on the above research, the high-quality preparation of the composite was achieved. Furthermore, the micro-morphology, mechanical properties, thermal expansion performance, dielectric properties as well as high temperature resistant performance of the composite were investigated and verified by experiments. The composite exhibits excellent thermal stability with Tg above 500℃ and T5% up to 625℃, and quartz lamp experiment further indicates that the high temperature resistant ability is up to 520℃/1000 s. The dielectric constant is 3.1~3.2 and dielectric loss is less than 0.003. In addition, the mechanical property is enough for functional composite. The above research indicates that the novel silicon-containing polyarylacetylene resin based wave-transparent composite has high potentials in the fields of aeronautics and astronautics.