Abstract
Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable metallic copper on the polyimide film was precipitated even in air. Since this copper was generated only in the laser-irradiated parts, direct patterning of copper wiring was possible. It was also found that copper was precipitated by electroless copper plating on the laser-deposited copper wiring and it was possible to thicken the copper wiring by this precipitation. The resistivity of the copper wiring was almost the same as that of the bulk of metallic copper. The developed method—combining laser irradiation to a copper-complex-coated film and electroless copper plating—enables the high-speed deposition of fine copper wiring on a polyimide film in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring without high vacuum facility and heat-treatment under inert gas.
Highlights
IntroductionA method called “printable electronics”—which produces electronic devices using a low-cost printing method—has been attracting much at-
It was found that copper was precipitated by electroless copper plating on the laser-deposited copper wiring and it was possible to thicken the copper wiring by this precipitation
In consideration of the above-mentioned problems with the conventional method, we studied forming fine copper wiring on a polyimide film by the newly-developed method
Summary
A method called “printable electronics”—which produces electronic devices using a low-cost printing method—has been attracting much at-. It has been reported that stable metallic copper is precipitated in air by laser irradiation of a copper-complex film having glyoxylic acid bonded as a ligand and that it is possible to perform direct drawing (“direct patterning”) of copper wiring by utilizing the phenomenon by which copper precipitates only in the laser-irradiated part of the film [15] [16] This method makes it possible to form fine copper wiring at high speed by laser irradiation of a copper metal complex that is stable and easy to handle in air; it is attracting attention as a simple and low-cost technology for forming copper wiring that does not require high-vacuum equipment or treatment under inert gas. This paper reports the results of our investigation on direct patterning of fine copper wiring on a polyimide film by laser irradiation to the stable mixed-copper-complex film and the observation results (the surface state and cross-sectional structure of the formed copper film) concerning thickening of the copper wiring by electroless copper plating on the laser-deposited copper wiring
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
