Abstract
Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 μm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10–5 Ω·cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.
Highlights
As electronic devices become smaller, more powerful, and more sophisticated, the development of higher densities of electrical wiring is progressing rapidly
The aim of our research is to develop a simpler method of fabricating copper wiring, and we have been investigating high-speed fabrication of fine wiring in air using a stable copper metal complex and laser irradiation
In the resulting copper complex (GACu), it is deduced that the hydrate formyl form of glyoxylic acid coordinates a one-molecule ligand and the remaining two ligand parts have bonded with H2O
Summary
As electronic devices become smaller, more powerful, and more sophisticated, the development of higher densities of electrical wiring is progressing rapidly. This is creating a strong demand for the development of techniques of fabricating fine metal wires inexpensively. Physical film formation methods in a high vacuum, such as sputtering or vacuum deposition, are mainly used in the fabrication of wiring for electronic de-. How to cite this paper: Ohishi, T. and Kimura, R. (2015) Fabrication of Copper Wire Using Glyoxylic Acid Copper Complex and Laser Irradiation in Air. Materials Sciences and Applications, 6, 799-808. Such methods require large-scale high-vacuum equipment and are one reason behind the increasing cost of manufacturing electronic devices
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