Abstract
In this study, uniform BaO–B2O3–SiO2 glass coatings on micro Cu powders with different glass/Cu ratio were prepared by sol–gel method. The pastes prepared with the glass-coated Cu powders were screen printed on low temperature co-fired ceramic (LTCC) substrate. Then the dry films on substrate were binder-burned-out at 400 °C in air and co-fired at 910 °C in N2 atmosphere. During the binder-burning-out process, the oxidization of the films with 9 and 11 wt% glass was slight because of the improvement of oxidization resistance of the glass-coated Cu powders. Moreover, the sintered film with 9 wt% glass coating showed no crystal phase of copper oxide and had small sheet resistance of 1.3 mΩ/□, which can be used as good conductive thick film on LTCC substrate for microelectronic packaging.
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