Abstract
To prepare high temperature resistant polyimide thin films, we have discussed the synthesis of high-purity diamine precursors in this study. We have prepared polyamide acid solutions first via two-step solution-based polymerization of heat-resisting diamine and dianhydride, and then obtain polyimides after dehydration during a high temperature curing process. The thermal, mechanical and hygroscopic properties of four polyimides thin films were tested and compared.
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