Abstract
The International Conference “High-tech and Innovations in Research and Manufacturing (HIRM-2021)” successfully took place in Krasnoyarsk, Russia, on September 14-15, 2021. The organizers of HIRM 2021 were AeroSpace school (Krasnoyarsk, Russia) and IT Lab (Krasnoyarsk, Russia). The main goal of the conference was to develop the scientific cooperation between Russian and international researchers in the field of information technologies as well as technical sciences.Due to the ongoing global pandemic, the conference was held mostly in videoconference format. Participants in Krasnoyarsk could deliver their report in video class with the assistance of the organizers. Access to the online was also provided for visitors of AeroSpace schools in the lecture hall. The non-local audience joined the meeting via Zoom platform.HIRM 2021 provided researchers with an opportunity to present and discuss the most recent innovations. The participants submitted papers on a whole range of topical issues of electronic engineering, data processing, material science, industrial automation, mechatronics and electromechanics. Innovative ideas and projects were presented that can significantly improve modern manufacturing. Not only Russian researchers participated in HIRM 2021 - we also had participants from Uzbekistan and Kazakhstan.Scientists and practitioners submitted more than 100 papers in total. The editors and committees to make a success of HIRM 2021 carefully reviewed all of them. As a result, the conference proceedings were compiled. We hope that this volume will show the readers an overview of the latest advances and smart solutions in the field of manufacturing as well as theoretical research.It was a great honor to work with all the participants, the Organizing Committee members, the editors and reviewers. We would like to express our gratitude to everyone involved. Without this dedicated cooperation, it would be impossible to hold the conference at such a high level and prepare the HIRM 2021 proceedings.List of Conference Committee, Editorial Board are available in this pdf.
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