Abstract
International Virtual Conference on Bridging Innovative Trends in Mathematics, Engineering & Technology-BITMET’20Bridging Innovative Trends in Mathematics, Engineering & Technology-BITMET’20M.parimalaDr. G.M. Arun PrasathDr. Waseem Ghazi AlshantiDr. E. BalamuruganDr. Renuka MohanrajK.Palani1 Department of Mathematics, Bannari Amman Institute of Technology, Sathyamangalam, Erode, tamilnadu, India.2 University of Technology andApplied Sciences, Oman3 Jubail University College, King SaudiArabia4 University of Africa, NIGERIA5 Maharishi InternationalUniversity-Fairfield, USA6 PG & Research Department of Mathematics,A.P.C.Mahalaxmi College for Women, Thoothukudi, TN,IndiaInternational Virtual Conference on Bridging Innovative Trends in Materials Science (BITMS-2020) provides a global platform for academics, researchers and students to share their knowledge, work and experiences both through the presentations/posters from the conference and dissemination of high quality research publications in the areas of Mathematics, Engineering & Technology. This acts as an international forum for researchers and scholars to have face-to-face interactions with an eminent speakers and experts to discuss the most recent innovations, trends and concerns as well as practical challenges encountered and solutions adopted in the fields of Mathematics, Engineering & Technology.Dr. G.M. Arun Prasath University of Technology and Applied Sciences, Oman ‘Applications of Analytic Hierarchy Process in Science and Technology’ Dr. Waseem Ghazi Alshanti Jubail University College, King Saudi Arabia ‘On the Horizontal Deviation of a Spinning Projectile Penetrating into Granular Systems’ Dr. E. Balamurugan, University of Africa, NIGERIA ‘Role of Mathematics in Artificial Intelligence’ Dr. Renuka Mohanraj, Maharishi International University-Fairfield, USA ‘Internet of Things for Android’International Virtual Conference on Bridging Innovative Trends in Mathematics, Engineering & Technology-BITMET’20, Organizing Committee, Convener, Coordinators, Internal Members, International Technical Committee Members and this titles are available in this pdf.
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