Abstract
In 1993, IBM began replacing bipolar emitter-coupled logic (ECL) in its large mainframe computers with complementary metal-oxide semiconductor (CMOS) logic because of the very high integration density of CMOS, its high switching speed, lower switching current, and excellent reliability. Advances in CMOS microprocessor technology have had a spillover effect on packaging technology. The increased functionality and density of CMOS-based control chips, along with the use of surface-mount technology, have resulted in the denser packaging required to support multichip modules (MCMs).
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